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Micrel 6” MEMS Foundry Services
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Micrel is expanding its toolset capabilities to address its fast growing MEMS business. Micrel has a state-of-the-art SPTS PegasusTM DRIE machine which boasts the fastest deep silicon etch rates available as well as superior sidewall smoothness and cross-wafer uniformity. The PegasusTM is the tool of choice for the very high aspect ratio features and large cavities required for today’s MEMS products and for Through Silicon Vias (TSV). MEMS customers also have the option for monolithic integration with CMOS as well as access to all of Micrel's IC products for package-level integration. At Micrel, fabless customers enjoy the rare capability for production of a
full MEMS sensor system at one facility.
MEMS Processes
 MEMS-only or CMOS+MEMS integrated processing
Inkjet 
Inertial, pressure, Hall, optical and infrared sensors Microphones, resonators Electrostatic actuators, capacitive and piezoresistor sensors 0.5µ stepper lithography with front-to-back side alignment Stitching capability for large die SOI (Silicon on Insulator) TSV Trench Isolation Thin/Thick epi Doped/undoped polysilicon Thermal, LPCVD and PECVD oxide Dry oxide/nitride etch Dry poly etch LPCVD (low stress) nitride and PECVD nitride State-of-the-art DRIE etch on SPTS Pegasus KOH etch CMOS-compatible metals:  thin and thick metal dry etch Ti, W silicides CVD W Rapid Thermal Processing Resist Planarization SOG CMP Indium Tin Oxide Sputtering and Etch Ti, TiN, Ta, TaAl Sputtering and Etch Thin Silicon Processing Silicon Texturing SiC Coating Anti-Reflective Coatings Coming soon: XeF2: anhydrous HF release Thick Resist Porous Silicon Etch |
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FOUNDRY 
