Micrel’s foundry provides a wide variety of flexible wafer fabrication and processing resources that address unique requirements for short runs or for volume production.
Micrel offers a wide array of test and measurement capabilities as part of their in-line process controls.
N+ or P+ dopants are diffused into silicon as part of the post-masking process.
A well-documented and controlled computer-generated process traveler gives Micrel the capability to run a wide variety of technologies. For analog products, Micrel can add DMOS or bipolar devices to CMOS technologies, CMOS devices to bipolar technologies, thin-film resistors, Zener-zap devices, special capacitors, and many other enhancements.
You have a choice in selecting the classification and quality standards to which your devices are manufactured. You may select upgrades to Industrial Class-B, Military Class-S or Class-B (MIL-STD-883), or custom production requirements designed to your particular specification definitions.
Applied Materials Centura® Etcher for defining ultra-fine geometries.
A look inside the advanced equipment of the Applied Materials Centura® Etcher used in defining ultra-fine geometries.
Applied Materials Endura® system utilized in the Physical Vapor Deposition (PVD) process.
Applied Materials Rapid Thermal Processing (RTP) technology for use in activating shallow junctions.